Electronic Assembly Training Workshops

Mukul Luthra, an expert consultant with over 30 years of electronic assembly experience in high volume manufacturing, quality and process engineering, presents a series of hands-on training workshops that address critical modern electronic assembly challenges. Custom electronic assembly training workshops are also available to meet your specific needs.

For more information: register to download the Electronic Assembly Training Workshops brochure in .pdf format

This two-day course provides a solid foundation in Lead Free Soldering from Legislation, Equipment classes impacted, to the Metallurgical interactions and process impacts. These are dealt with in the light of current trends, solders and metallization with emphasis on dealing with the many soldering issues encountered in the Lead Free conversion process.

This workshop is divided into ten modules that include: Lead Free drivers, inspection, soldering alloys, soldering metallurgy, alloy options, Lead Free process considerations, reliability, surface metallization, and process issues.

Who Should Attend: Those responsible for implementing Lead Free technology, maintaining Lead Free yields, and for those roles that directly impact yields in Manufacturing, Assembly, Equipment Maintenance, Failure Analysis, Vendor Quality, and Incoming Quality.

A two-day intensive workshop that covers in-depth aspects of BGAs, Micro BGAs, and Bumped Array CSPs, including their structure, families, advantages, features, assembly of the device on the PCB and rework processes. Attendees will acquire an excellent understanding of the attachment variables, assembly requirements, assembly variants such as mirror image assembly, the process issues that may be encountered and how to troubleshoot and correct them.

This program is organized into seven modules that include: packaging drivers and BGA trends, BGA and Array CSP assembly considerations, imaging techniques, understanding and eliminating defects, Chip Scale Packaging (CSP), and rework.

Who Should Attend: Engineering personnel from Manufacturing, Assembly, Equipment, Materials and Failure analysis disciplines. The course is also extendable to Technicians or Supervisory levels.

Workshop 3
Advanced SMT – Practical Approaches and Techniques for SMT Process Enhancement

Through this two-day workshop delegates learn about the latest trends in packages, grasp the complex interaction between variables, and discover how to control and manage them for a successful process. The workshop focuses on small form factor, miniaturization and advanced packages assembly and control. Participants also learn how to deal with typical and difficult issues, from mainstream assembly to many of the new devices and attachment methods.

This course has twelve modules that include: SMT directions, process considerations, Lead Free challenges, reflow engineering, wave soldering, soldering metallurgy, BGA and CSP assembly and control, Chip-On-Board (COB) in mainstream SMT, Flip Chip (FC) processes, analytical tools, and improving rework yields.

Who Should Attend: Engineering personnel from Manufacturing, Assembly, Equipment, Materials and Failure analysis disciplines. The course is also extendable to Technicians or Supervisory levels.

Workshop 4
Direct Chip Attachment in Mainstream SMT – Selection, Design and Processing

DCA has gained tremendous importance in the evolving field of SMT with ‘Bare Dies’ being thought of by many as the next ‘Wave of Packaging’. This two-day workshop covers and provides an understanding of the selection criterion and considerations for bare dies, their quality and acquisition. It also covers Flip Chip (FC) and Chip-On-Board (COB) attachment technologies in terms of positioning, design guidelines and attachment considerations, usage, equipment, process development and analysis with real life examples.

This workshop is divided into eight modules that include: direct chip attachment, bare dies, Flip Chip design rules, Flip Chip attachment, failure analysis, and Chip-On-Board attachment.

Who Should Attend: This is a high level program that targets personnel from Engineering, Process, Manufacturing, Assembly, Failure Analysis and Quality disciplines.

The objective of this one-day Workshop is two fold. Firstly the workshop will lay a foundation and understanding of the Tin Whiskers, their morphology, microstructure and review the risks and extent of impact on the end product. The course will detail the studied growth mechanisms and conditions including the impact of the environment on whisker growth and compare the various investigations and growth propositions.

The second part of the workshop will deal with the control aspects and the strategies for control including for example, the use of conformal coatings to mitigate the formation and growth of Tin Whiskers. [Conformal coatings are mentioned here as an example as being of the few processes actually under the control of the end user].

This program is organized into four modules that include: Overview of Tin Whiskers, whisker growth models, control strategies and challenges.

Who Should Attend: This is a high level program and requires a pre-understanding of SMT concepts. The target audience will comprise personnel from Engineering, Process, Manufacturing, Assembly, and Failure Analysis disciplines. The audience scope can be extended to include experienced Technicians or Supervisory Level staff.

For more information: register to download the Electronic Assembly Training Workshops brochure in .pdf format







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