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Presentations
Soldering Photo Albums
Bob Willis, world-renowned soldering expert, has developed an extensive
library of electronic assembly soldering photographs. These are available
on CD-ROM, and are an essential resource for process engineers and trainers
for illustration of soldering concepts. ALC is pleased to make Bob’s
well-known soldering photo albums available for secure on-line purchase.
These soldering photographs are provided as a resource for workshops
and general educational events. The images are also ideal for use in
manuals, standards, and to illustrate technical articles and textbooks.
The photographs are provided royalty free provided they are not resold
as individual images or as part of an image library.
Below each album description are links to a list, and low-resolution thumbnail
examples of the images. These are partial examples of the content, the
photo album CDs provide larger high-resolution images, are updated continually
and typically contain much more.
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Lead Free Assembly and Soldering – CD Photo Album
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Over 300 images are provided suitable for use
in presentations, company standards, inspection criteria, posters
and websites. Images include satisfactory and defective joints
with different lead-free solder alloys, chip component, fine pitch,
BGA and 0201 terminations are included with different termination
and PCB solder finishes.
Partial list of images | pdf Image examples |
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0201 Chip Component
Assembly and Soldering – CD Photo Album
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More than 220 images and 7 video clips. Includes
various views and size comparisons, tape packaging, handlers, satisfactory
and defective joints, misplacement, twisting and tombstoning, solder
paste deposit, incomplete reflow, reflow showing realignment, rework
of chip resistor, micro section and X-ray images of reflow joints,
and more.
Partial list of images | pdf Image examples |
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| Surface
Mount Process Defects – CD Photo Album
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600 images covering a full range of SMT defects including: tin/lead
contamination, leveling, plating, component cracking, co-planarity,
solderability, wetting, wicking, joint failure, shorts, skips,
spikes, balls, adhesive problems, printing, BGAs, QFPs, SOTs, PLCC,
J and gull wing terminations, chip capacitors, and much more.
Partial list of images | pdf Image examples |
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Ball
Grid Array – CD Photo Album
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370+
photos showing many BGA solderability issues, includes: alignment,
solderability, paste deposit, dumbbell and teardrop pads, plastic,
ceramic, hybrid BGAs, uBGAs, solder pre-form, rework, opens and
shorts, placement, and more. Includes many micro section and X-Ray
images.
Partial list of images | pdf Image examples
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Pin in Hole Reflow Soldering – CD Photo Album
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More
than 220 illustrations covering pin in hole reflow soldering including:
paste deposit, PGA solder fillets, connector fillets, balling,
lifting of header, paste displacement, hole fill, voids, poor wetting,
poor solder fill, through hole pins and pads, reflow through hole,
edge connector reflow, and more. Includes micro sections and X-Ray
images.
Partial list of images | pdf Image examples |
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Flip Chip Assembly – CD Photo Album
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Flip
chip assembly and processing of flip chip assemblies is illustrated
with over 230 images. There are two file folders on this CD with
photographs and one with x-ray images. Photographs are correctly
sized for use in PowerPoint presentations. Selected files on the
main directory are at higher resolution for other applications.
Partial list of images | pdf Image examples
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Solder
Paste Printing – CD Photo Album
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260+
photos for use in presentations, company standards, and inspection
criteria that illustrate satisfactory solder printing and solder
printing defectivity issues that include: solder skips, slumping,
smudging, misalignment, scooping, poor paste release, poor paste
wash off, stencil damage, poor stencil cleaning, includes SEM and
X-Ray images.
Partial list of images | pdf Image examples
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| Conventional
Assembly Process Defects – CD Photo Album
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than 260 images for use in presentations, company standards, and
inspection criteria. Images cover satisfactory and defective joints
and include: lifted PCB pads, plated through hole, track separation,
gold plate adhesion, de-wetting, PTH copper failure, pin holes,
lead trimming, solder fillets, repairs, static damage, and more.
Partial list of images | pdf Image examples |
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| Printed Circuit Board – CD Photo Album
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than 360 images illustrating many PCB problems including micro
sections of through hole and inner layers, copper voids, hole misalignment,
ring voiding, multi layer junction failure, contamination, resist
lift, solderability, misaligned solder mask, track repairs, delamination,
copper dendrites, etching defects, gold tab bloom, and much more.
Partial list of images | pdf Image examples |
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| Wire
Preparation and Crimping – CD Photo Album
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over 160 images this CD provides extensive coverage of wire preparation
including illustrations of satisfactory and unsatisfactory crimp
terminations, tool use, insulation stripping, pull tester, voltage
drop tester, coaxial cable, includes many micro section and X-ray
images.
Partial list of images | pdf Image examples |
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Surface Mount and Conventional Components – CD Photo Album
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An
extensive collection of component identification photographs for
both SMT and conventional through-hole components. More than 220
images that include radial and axial lead discrete components,
passive and active devices, transistors and diodes, large-scale
integrated circuits, chip resistors and capacitors. Many package
types and sizes are illustrated including, MELF, SOT, DPAC, DIP,
SOIC, VSOP, PLCC, LCCC, QFP, BGA, uBGA, CSP, and more.
Partial list of images | pdf Image examples |
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Mount and Conventional Joint Illustrations – CD Graphics
Album
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photographs, this album contains over 170 3D graphics illustrations
of both surface mount and conventional pin in hole joints. Includes
sections through printed circuit boards showing through hole plating,
radial lead discrete components, lead clinch, solder fillets, ICs
with various lead types, chip components, single and double sided
boards, solder paste deposit, component placement, wire lead terminal
connections, and more.
pdf Image examples |
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