Factory Toolbox – Contents of All Toolkits

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1. Square paste print
2. Split paste deposit
3. Round paste deposit
4. Bleeding on split deposit
5. Square paste print
6. Split paste deposit
7. Square paste deposit
8. Incomplete paste reflow
9. Square paste deposit
10. Incomplete paste deposit
11. Square/Round paste
12. Smeared round paste
13. Incomplete reflow
14. Body displaced paste
15. Body displaced paste
16. Body displaced paste
17. Paste with PGA inserted
18. Displace paste deposit
19. Displaced paste deposit
20. Displaced paste deposit
21. Base of pin header
22. Base of pin header
23. Base of two headers
24. Base of pin header
25. Balling due to header
26. Solder balling on resist
27. Balling due to header design
28. PGA solder fillets
29. PGA solder fillets
30. Topside solder fillets
31. Poor wetting on hole wall
32. Balling due to header
33. Lifting of header
34. Lifting of header
35. Lifting of header
36. PGA solder fillets
37. PGA solder fillets
38. Connector fillets
39. PGA solder fillets
40. PGA solder fillets
41. PGA solder fillets
42. Topside PGA fillets
43. PGA solder fillets
44. PGA solder fillets
45. Poor hole wetting
46. Solder balling on resist
47. Dried paste displacement
48. Dried paste displacement
49. Hole paste displacement
50. Hole paste displacement
51. Hole paste displacement
52. Paste hole fill
53. Hole paste displacement
54. Dried paste displacement
55. Hole paste displacement
56. Long pin displacement
57. Microsection with solder ball
58. Microsection with void
59. Microsection of PGA lead
60. Microsection with void
61. Section with poor wetting
62. Microsection with small void
63. Pin with thick solder coating
64. Microsection with minor voids
65. Solder balls/poor solder fill
66. Poor solder fill
67. Poor solder fill
68. Poor solder fill
69. Satisfactory solder fill
70. Microsection of joint
71. Microsection with minor voids
72. Solder balls on pin
73. Microsection with ball
74. Microsection with solder ball
75. Microsection with solder ball
76. Microsection of PGA pin
77. Microsection of joint
78. Microsection with solder ball
79. Pin with thick solder coating
80. Microsection with voids
81. Microsection of satisfactory joint
82. Microsection with minor voids
83. Microsection with minor void
84. Microsection with minor void
85. Microsection with minor void
86. Microsection with minor void
87. Variable solder joints
88. Variable solder joints
89. Through hole coils inserted
90. Through hole pins/pads
91. Reflowed though hole pins
92. Dispensed paste deposits
93. Dispensed paste deposits
94. Edge connector reflow
95. X-Ray showing minor voids
96. X-Ray showing minor voids
97. X-Ray showing minor voids
98. Example of solder preform
99. Example of solder preform
100. Example of solder preform
101. Example of solder preform
102. X-Ray showing minor voids
103. X-Ray showing minor voids
104. X-Ray showing minor voids
105. X-Ray showing minor voids
106. PIHR X-Ray showing minor voids
107. PIHR X-Ray showing minor voids
108. PIHR X-Ray showing minor voids
109. PIH paste deposit
110. PIH paste deposit
111. PIH paste deposit
112. PIH 100% paste fill
113. Paste reflow test on resist
114. Paste reflow test on resist
115. Base of connector
116. Base of connector
117. Side view of connector pins
118. Base of connector and pins
119. Edge connector and retention clip
120. Connector in tape and reel packaging
121. As above
122. As above
123. As above
124. As above
125. As above
126. As above
127. As above
128. Connector pin in tape and reel packaging
129. As above
130. As above
131. As above
132. As above
133. As above
134. As above
135. As above
136. Assembled board and connector not soldered
137. As above
138. Heat damage to connector
139. Heat damage to connector
140. Heat damage to connector
141. Heat damage to connector
142. Heat damage to connector
143. Paste displacement
144. Paste displacement
145. Paste displacement
146. Paste displacement
147. Paste balling on long pins
148. Incomplete paste reflow
149. Paste displacement
150. Paste displacement
151. Paste displacement
152. Paste displacement
153. PIHR connector
154. Push fit retainer
155. Spring fit connector
156. As above
157. Hold down feature
158. Jack connector
159. Jack connector
160. Jack connector
161. IDC connector
162. Connector with shielding
163. SMT/through hole retention
164. Hold down force fit features
165. Hold down force fit features
166. Satisfactory connector for automatic assembly
167. As above
168. As above
169. As above
170. As above
171. As above
172. Hold down features
173. Staked hold down retention
174. PIHR connector
175. IDC connector
176. Nine way connector with location pegs
177. Fuse holder
178. IDC postheader
179. Right angle IDC connector
180. Shielded connector
181. Vacuum pickup clip
182. Vacuum pickup connectors in tape and reel
183. Incomplete reflow of paste
184. As above
185. As above
186. Paste print to aid hole location
187. Stencil for above pattern
188. X-ray of lead free fillet lifting
189. X-ray of lead free fillet lifting
190. X-ray of lead free fillet tearing
191. X-ray of lead free fillet lifting
192. X-ray of lead free fillet lifting
193. X-ray of lead free fillet lifting
194. X-ray of lead free fillet lifting
195. X-ray of lead free fillet lifting
196. X-ray of lead free fillet lifting
197. X-ray of lead free fillet tearing
198. X-ray of lead free fillet tearing
199. X-ray of lead free fillet lifting
200. X-ray of lead free fillet lifting
201. X-ray of lead free fillet lifting
202. X-ray of lead free fillet lifting
203. X-ray of lead free fillet lifting
204. Solder paste filling hole, poor wash off
205. Solder paste filling hole, poor wash off