Objectives
Participants successfully completing
the course are able to identify and explain:
-
Concepts of rework
and lead-free rework.
-
Areas of rework affected by
transition to lead-free.
-
Defects more likely to occur
with lead-free assembly.
-
Appearance of acceptable tin/lead
and lead-free joints.
-
Care of soldering equipment
and demands of lead-free.
-
Solder types based on labelling
and naming conventions.
-
Role of flux and the impact
of lead-free.
-
Impact of lead-free on board
laminates and finishes.
-
Maintaining a mixed tin/lead and lead-free facility.
-
Removal,
cleaning, and replacement for through-hole, SMT.
-
Cleaning
procedures after reworking lead-free.
-
Moisture control in lead-free
rework.
-
Challenges in reworking SMT
area-array devices.
-
Optical and X-ray Inspection
for area-array devices.
-
Temperature issues for area-array
devices with lead-free.
| Qualification and Certification Testing |
|
LearnTech® training
incorporates interactive learning checks throughout the instructional
sequences. Certification tests are criterion-referenced and module-based
with feedback on every response for enhanced learning. The tests
also include a scorebar to provide the learner with continuous
status information. Administrative access to dates and scores of
tests, certifications, and re-certifications is compliant with
ISO quality-standards requirements.
Standard Compliant
This course applies JEDEC Standard JESD97 for
Identification of Lead(Pb) Free Assemblies, Components, and Devices.
Purchase the on-line web-training version of this course for individual
use: Buy now on-line
Sign in to view a demo of Lead-Free
Soldering: Rework!
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