Objectives
Participants successfully completing
the course are able to identify and explain:
-
Impact of lead-free materials on the SMT reflow soldering process
- Solder paste specifications and materials considerations
- Reliability, acceptance criteria, cosmetics
- Flux specifications, no-clean fluxes, high solids, water based
- PCBs, surface finish, component lead-finish and packaging, DFM
- Temperature compatibility, Moisture Sensitivity
- Solder joint defects in reflow
- Screen printing alignment, errors, maintenance, stencil design
- Placement accuracy, self–alignment, preventive maintenance
- Process window, heat transfer, heat types, profiles, cooling
- Benefits and indicators for the use of Nitrogen
- Profiling for lead-free, measurement techniques
- Designing experiments, Taguchi orthogonal variable arrays
- Pre-heat, reflow, cool down, use of indicator labels, thermocouples
- Thermal mass and profile, interaction with conveyor speed
- Peak temperature, delta T and TAL
- Cleaning after soldering, cosmetics, ionic residues, inspection standards
- Automated optical, x-ray inspection
- Process monitoring, SMT soldering problems, corrective action
| Qualification and Certification Testing |
|
LearnTech® training
incorporates interactive learning checks throughout the instructional
sequences. Certification tests are criterion-referenced and module-based
with feedback on every response for enhanced learning. The tests
also include a scorebar to provide the learner with continuous
status information. Administrative access to dates and scores of
tests, certifications, and re-certifications is compliant with
ISO quality-standards requirements.
Standard Compliant
This course applies JEDEC Standard JESD97 for
Identification of Lead(Pb) Free Assemblies, Components, and Devices.
How to Buy |
