Course Code: SLS

Delivery: LAN

Audience

A modular interactive multimedia learning program intended for process engineers and technicians involved in the implementation, operation, and monitoring of lead-free soldering SMT processes.

• Impact of lead-free materials on the SMT reflow soldering process
• Solder paste specifications and materials considerations
• Reliability, acceptance criteria, cosmetics
• Flux specifications, no-clean fluxes, high solids, water based
• PCBs, surface finish, component lead-finish and packaging, DFM
• Temperature compatibility, Moisture Sensitivity
• Solder joint defects in reflow
• Screen printing alignment, errors, maintenance, stencil design
• Placement accuracy, self–alignment, preventive maintenance
• Process window, heat transfer, heat types, profiles, cooling
• Benefits and indicators for the use of Nitrogen
• Profiling for lead-free, measurement techniques
• Designing experiments, Taguchi orthogonal variable arrays
• Pre-heat, reflow, cool down, use of indicator labels, thermocouples
• Thermal mass and profile, interaction with conveyor speed
• Peak temperature, delta T and TAL
• Cleaning after soldering, cosmetics, ionic residues, inspection standards
• Automated optical, x-ray inspection
• Process monitoring, SMT soldering problems, corrective action

LearnTech® training incorporates interactive learning checks throughout the instructional sequences. Certification tests are criterion-referenced and module-based with feedback on every response for enhanced learning. The tests also include a scorebar to provide the learner with continuous status information. Administrative access to dates and scores of tests, certifications, and re-certifications is compliant with ISO quality-standards requirements.

Standard Compliant

This course applies JEDEC Standard JESD97 for Identification of Lead(Pb) Free Assemblies, Components, and Devices.

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