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| Class 0 ESD Article Links |
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Allen, Ryne C. (2001). ESD Discharge Times: Controlling Your Discharges. Chase, Gene. (Sep 2007). An Electrostatic Discharge Packaging
Compendium. Dangelmayer, Ted. (2003). Strategic and Economic Benefits of an ESD Program. Dangelmayer, Ted and Welsher, Terry. (2003). ESD Packaging Considerations. De La Isla, Will. (2005). Check your ESD-Protective Products. ESD Association. (Sep 2007). ESD Standards: An annual progress
Report. ESD Standards. (2006). ESD Systems. Comparison of ANSI/ESD S20.20 with EAI-625. Halperin, Stephen. (October 2004). HBM Device Failure: The Scourge of Static Sensitive Operations. Long, David. (Sep 2007). Seven mandatory Considerations Before
Handling Class 0 ESDS Devices Long, David. (Jan 2007). Potential conflicts When Evaluating
ESD Flooring. Maynes, Curtis. (Feb 2006). Technology Roadmap Sees Higher Sensitivity to ESD. Oh-Hun Kwon and Matthew Simpson. (August 2003). ESD-Safe Ceramics for Critical Static Problems. Resurreccion, Carl and Vermillion, Bob. (Mar 2007). Steady
State DC Air Overhead Ionization: An Evaluation. Swenson, David E. (2004). ANS/ESD S541: ESDA Releases Critical New Packaging Standard. Steinman, Arnold. (2006). Basics of Air Ionization for High-Technology Manufacturing Applications. Steinman, Arnold. (2004). Preventing Electrostatic Problems in Semiconductor Manufacturing. Wallash, Al . Understanding ESD Damage to Magnetoresistive Recording Heads. Welsher, Terry L. and Dangelmayer, G. Theodore. (2005). Class 0 ESD: A Driver for Change in Assembly ESD Control Programs. |
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© Automated Learning Corporation, 2004 Manufacturing training in Lean, ESD, SMT, Electronic Assembly |