The first of three modular interactive multimedia
learning programs for operators working in circuit card assembly.
Companies have also found these useful for orienting other personnel
to the overall manufacturing process.
Objectives
Participants successfully completing this course
will be able to:
Describe the overall circuit
card assembly process
Identify the role of the operator
in maintaining quality
Explain the function and use
of process documents
Explain the differences between
surface mount, through hole, and mixed technology assembly
Explain the key steps of surface
mount assembly (SMA) including: paste print, component placement,
reflow, glue dispense and cure, inspection, and rework
Explain the key steps of through
hole assembly (THA) including: auto and hand component insertion,
wave and hand soldering, inspection, and rework
Describe the main types of circuit
card testing
Describe key processes supporting
assembly including:
- component preparation and kitting
for SMA
- component preparation and kitting
for THA
- programmable device preparation
- point of use inventory management
LearnTech® training incorporates interactive
learning checks throughout the instructional sequences. Certification tests are criterion-referenced and module-based with feedback on every response
for enhanced learning. The tests also include a scorebar to provide
the learner with continuous status information. Administrative access to dates and scores of tests, certifications, and re-certifications is compliant with ISO quality-standards requirements.
